Where the watts meetthe water.
Iron Grid owns the integration layer between power delivery and direct-to-chip or immersion cooling for 60–150 kW/rack AI data centers. Most contractors hand off at the rack PDU. We don't.
Rosendin runs the conduit.
Cupertino lands the busway.
Holder pours the slab.
Nobody owns what happens between the CDU and the chip. That seam is where most AI deployments fail: thermal interlocks, leak detection, redundancy mismatch, controls drift.
Six scopes. One contract. One throat to choke.
Watts in, heat out — interlocked by design.
Every kilowatt that enters a rack must leave as heat in the loop within the same second. Legacy contractors treat that as two contracts. We treat it as one physical system.
rack
The build is loud. The integration is quiet.
We're embedded with the OEMs that ship the kit.
Pre-engineered against Vertiv, Schneider, CoolIT, Motivair, and the cooling skids that actually meet AI-cluster lead times.
Spinning up a
100+ kW/rack build?
We work with a small number of teams at a time. Tell us your rack target, your cooling preference, and your COD. We'll come back in 48 hours with a scope.